• Assembly of Innovative Electronics
  RadiSurf’s molecular adhesion allows for tight and strong bonds between plastics and metals that traditionally are challenging or almost impossible. Therefore, by enabling new combinations of materials to be joined, new and more innovative electronics parts and components can be developed and created.
• Temperature Resistant Adhesive
  The ultra-tight and ultra-thin adhesive interfaces achieved through RadiSurf’s technology are also very stable at high temperatures, making them ideal for use in electronic applications.

• Durable Adhesion through Overmolding
  Overmolding is often used when joining plastics and metals. However, delamination (separation) of plastics and metals often occur when they are cooled down, due to differences in the coefficient of thermal expansion. RadiSurf prevents this issue through our molecular adhesive technology, which, ensures strong and watertight adhesive interfaces. RadiSurf has e.g. been working with electronic suppliers to develop watertight adhesion solutions for Thermoplastic Polyurethane (TPU). Also, applications of overmolding with glass-filled PPS for watertight applications is an important application.