Adhesion of PP on metal surfaces

Polypropylene (PP) combines many of the most desired features of plastics such as high chemical stability, high-temperature stability, high strength, low price etc. However, due to the chemical structure of polypropylene, PP has an extremely low surface energy. This is a huge challenge as most common adhesives do not work on low energy surfaces. For the very same reason over molding metal with PP does not result in a substantial adhesion. So adhesion of PP to almost any material remains a huge challenge despite the broad use of PP as a commodity plastic.

 

Adhesion of PP is difficult due to the chemical structure of PP.

The chemical structure of Polypropylene (PP)

Is RadiSurfs Molecular Adhesives the solution for PP Adhesion?

The molecular adhesion solutions developed for RadiSurf may be useful for adhesion of PP to metals, and similar materials. We are currently developing and testing our solutions with the aim of obtaining extremely strong adhesion of PP on metal surfaces in over-molding processes and with welding techniques. It is an ongoing project, and we are not ready to share the results just yet. However, if you sign up for our PP Adhesion Interest newsletter, we promise to keep you updated as soon as we have results that are ready to publish.

 

Applications for PP/metal hybrid components

We are looking for interesting test projects so if you have any good suggestions for applications where a tight and strong interface between PP and metal components would be important, please contact us. You can send us an e-mail at info@radisurf.com with your ideas and input. If you have any questions, you are also more than welcome to write us using the same e-mail address. We look forward to hearing from you.

RadiSurf
RadiSurf ApS
Arresoevej 5B
DK-8240 Risskov
Denmark
Phone: +45 91 91 91 10
Email: info@radisurf.com
VAT/CVR: DK-37039403

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RadiSurf is developing Molecular Adhesive systems for chemically clean, optimal adhesion of polymers on metal surfaces. Stay updated on newest developments.
  • Chemically clean adhesion
  • Low material consumptions
  • Designed to perfectly match the application.
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