RadiSurf is going to San Francisco!
From the 10th to 14th July, RadiSurf have been selected as one of 30 startups out of more than 100 to participate in the selection round of Plug and Play Tech Centre’s startup programme for companies within new materials & packaging industry.
If selected, RadiSurf will participate in this 12-week startup accelerator program, organized by innovation platform Plug and Play, that brings together established corporations, industry experts, and startups within the various fields.
Besides this exciting opportunity, we are looking forward to meeting with interested parties and sharing more about our adhesion technology expertise and capabilities.
Let’s discuss more on how we can help you achieve more powerful, dynamic and durable products through expanding your material combination possibilities and performance!
Contact CEO Mikkel for more details: firstname.lastname@example.org or at +45 91 91 91 10
Read more about Plug and Play here: https://www.plugandplaytechcenter.com/new-materials/